带宽提升：TSV大幅缩短互连距离，显著提升数据传输速率，能够支持HBM4等超高带宽需求；延迟降低：桥接器内部的TSV路径比传统封装走线更短，有效降低数据通信延迟；功耗优化：短路径低电容，有助于降低整体系统功耗，符合高性能芯片的PPA（功耗、性能、面积）优化目标。
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The tradeoff is complexity. The microcode must be carefully arranged so that the instructions in delay slots are either useful setup for both paths, or at least harmless if the redirect fires. Not every case is as clean as RETF. When a PLA redirect interrupts an LCALL, the return address is already pushed onto the microcode call stack (yes, the 386 has a microcode call stack) -- the redirected code must account for this stale entry. When multiple protection tests overlap, or when a redirect fires during a delay slot of another jump, the control flow becomes hard to reason about. During the FPGA core implementation, protection delay slot interactions were consistently the most difficult bugs to track down.